MacDermid Alpha Electronics Solutions Electroless Copper Plating Solutions for PCBs M-Copper Omega ®

Product Overview The M-Copper Omega is a high-deposition metallization process that combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post-pattern plate backlight performance. The statistically designed electroless copper bath produces the highest reliability on microvias and high aspect ratio holes.