Lead-free, zero-halogen solder paste designed for broad latitude, high reliability applications, requiring process flexibility and residue containment.
Product Overview
ALPHA OM-353 is a zero-halogen solder paste engineered to provide superior electrochemical performance and minimize residue spread. This results in superior electrochemical performance down to 0.200 mm spacing on harsh automotive profiles. ALPHA OM-353 in combination with the Innolot alloy provide the optimal solution for high reliability applications.
Designed with manufacturing flexibility in mind, this solder paste is compatible with Type 5 powders for fine feature applications and available with traditional lead free alloys such as SAC305 or low silver SACX. ALPHA OM-353 combines world class print and reflow performance with consistent transfer efficiency and excellent non-wet open and head-in-pillow performance making this solder paste ideal for broad latitude application.
Product Features
Broad latitude paste with wide print process window on fine aperature sizes
Excellent electrochemical reliability on fine pitched components in harsh operating conditions
Superior post reflow residue containment
Compatible with industry leading Innolot high reliability solder alloy
Excellent HiP performance
Lead-free, zero-halogen solder paste designed for broad latitude, high reliability applications, requiring process flexibility and residue containment.
Product Overview
ALPHA OM-353 is a zero-halogen solder paste engineered to provide superior electrochemical performance and minimize residue spread. This results in superior electrochemical performance down to 0.200 mm spacing on harsh automotive profiles. ALPHA OM-353 in combination with the Innolot alloy provide the optimal solution for high reliability applications.
Designed with manufacturing flexibility in mind, this solder paste is compatible with Type 5 powders for fine feature applications and available with traditional lead free alloys such as SAC305 or low silver SACX. ALPHA OM-353 combines world class print and reflow performance with consistent transfer efficiency and excellent non-wet open and head-in-pillow performance making this solder paste ideal for broad latitude application.
Product Features
- Broad latitude paste with wide print process window on fine aperature sizes
- Excellent electrochemical reliability on fine pitched components in harsh operating conditions
- Superior post reflow residue containment
- Compatible with industry leading Innolot high reliability solder alloy
- Excellent HiP performance
