Nano-silver paste for large-area attachments (module to baseplate, heat sink) with a thick, reliable bond line.
Product Overview
ALPHA Argomax 2047 is a nano-silver sintering paste developed to meet the growing demand for large-area attachment applications, such as module-to-baseplate and heat-sink attachment. It provides a thick bond line, ensuring a reliable attachment between surfaces. Formulated for printing on Ag/Au surfaces and designed for component placement on wet paste with high tack. The paste features a pure silver bond line for high performance, offering excellent thermal and electrical conductivity, as well as reliability. It also provides flexibility in bond line thickness and requires low sintering pressure for high-yield manufacturing.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Soldering Irons, Stations, and Accessories |
| Product Name | ALPHA ® Argomax ® 2047 Paste |
