MacDermid Alpha Electronics Solutions ALPHA ® NCP-390 Solder Paste

Description
No-clean, lead-free solder paste meets zero-halogen specs with low voiding and excellent fine-feature printing performance. Product Overview ALPHA NCP-390 is designed to enable consistent fine-pitch printing capability down to a 70μm stencil opening, with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability. It's also available as a dispensing solder paste for low-voiding applications.
Request a Quote
Description
No-clean, lead-free solder paste meets zero-halogen specs with low voiding and excellent fine-feature printing performance. Product Overview ALPHA NCP-390 is designed to enable consistent fine-pitch printing capability down to a 70μm stencil opening, with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability. It's also available as a dispensing solder paste for low-voiding applications.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
ALPHA ® NCP-390 Solder Paste -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA ® NCP-390 Solder Paste
ALPHA ® NCP-390 Solder Paste
No-clean, lead-free solder paste meets zero-halogen specs with low voiding and excellent fine-feature printing performance. Product Overview ALPHA NCP-390 is designed to enable consistent fine-pitch printing capability down to a 70μm stencil opening, with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability. It's also available as a dispensing solder paste for low-voiding applications.

No-clean, lead-free solder paste meets zero-halogen specs with low voiding and excellent fine-feature printing performance.

Product Overview

ALPHA NCP-390 is designed to enable consistent fine-pitch printing capability down to a 70μm stencil opening, with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability. It's also available as a dispensing solder paste for low-voiding applications.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Soldering Irons, Stations, and Accessories
Product Name ALPHA ® NCP-390 Solder Paste
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® JP-501 -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
Kester ® TSF-6522RH Flux -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
ALPHA ® OM-353 Solder Paste -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details