Product Overview
ALPHA HiTech CU11-3127 is a high filler content product designed to provide enhanced mechanical strength for Chip Scale Packaging (CSP) and Flip Chip packages.
With its unique low-viscosity property, the material enables full coverage flow at room temperature without the need for preheating. For faster flow rates, preheating the substrate to below 80°C is recommended during the dispensing process.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Electrical and Electronic Resins |
| Product Number | ALPHA ® HiTech ® CU11-3127 Underfill |
| Product Name | Underfill Materials for Printed Circuit Boards (PCBs) |
| Industry | Semiconductors, IC's; Electronics |
