ATROX CD 560-1 is a Zero PFAS, thermosetting die attach paste designed for automated dispensing in metal lead-frame semiconductor packages. It is supplied in 5 or 10 cc syringes and cures in 60 minutes at 175 °C in a box oven or 10 minutes in a snap cure oven. The cured material has a glass transition temperature of 82 °C, a bulk thermal conductivity of 2.5 W/mK, and a volume resistivity of 0.0006 ohm-cm. Die shear strength is 13.5 kg on copper and 13.0 kg on PPF lead frames after curing at 175 °C for 1 hour. The material exhibits a coefficient of thermal expansion of 45 ppm below Tg and 225 ppm above Tg, with 2% weight loss on cure. It has a viscosity of 10,000 cps at 25 °C and a thixotropic index of 3.6.
Product Overview
ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored at -40ºC. Additionally, its low outgassing properties help minimize contamination, supporting high-quality and reliable performance.
Product Features
High Reliability
Achieves MSL-1 performance and zero delamination on leadframe packages.
Flexible Manufacturability
Box oven- and snap-cure capable
High Throughput Automated Dispensing
Optimum rheology* maximizes throughput with minimal machine downtime.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | ATROX ® CD 560-1 |
| Product Name | Advanced Conductive Die Attach for Semiconductors |
| Cure / Technology | Thermoset |
