MacDermid Alpha Electronics Solutions Copper Adhesion Promoters for IC Substrates MultiPrep 200

Product Overview The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask, dry film, and liquid photoresist adhesion on copper. By eliminating pumice and brush scrubbing, MultiPrep 200 provides a uniform copper surface topography, surpassing traditional bonding consistency. Product Features Micro-Roughened Surface The process delivers a micro-roughened surface excellent for soldermask adhesion to microvias and ultra-fine features, while also creating a strong, reliable bond between via fill and Plated Through Hole (PTH) copper. Optimized Copper Surface Roughening The enhanced bond between the soldermask coating and copper prevents adhesion loss during subsequent processes such as immersion tin plating, Hot Air Solder Levelling (HASL), and final assembly. Excellent Compatibility MultiPrep 200 is compatible with all final finish chemistries, including Electroless Nickel/Immersion Gold (ENIG), silver, Organic Solderability Preservative (OSP), and immersion tin finishes.