MacDermid Alpha Electronics Solutions Edgebond Epoxy ALPHA ® HiTech ® CF31-4026 Edgebond

Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), purposefully engineered for high-temperature automotive applications that require exceptional board-level reliability. With superior thermal cycling performance and reworkability at temperatures as low as 185°C, this advanced edgebond offers improved process yields to help reach sustainability objectives. Versatile in its applications, CF31-4026 extends its robust reinforcement to high reliability markets such as high-performance computing. This edgebond reinforces the Ball Grid Array (BGA) while avoiding contact with solder interconnects beneath the component. Its fluorescent appearance aids in efficient and accurate visual inspection. For industries that require both high temperature resilience and component reinforcement for extended operational life, ALPHA HiTech CF31-4026 is the optimal solution. Product Features High Glass Tg Ideal for automotive and other high-temperature applications. Low α1 Enabling excellent Thermal Cycling Test (TCT) performance for board-level reliability. Reworkable Edgebond Removable at 185-200°C for high-yield manufacturing and lower total cost of ownership (TCO). Superior Slump Performance Prevents material from spreading to solder interconnects beneath components, maintaining integrity and reliability in high-density Printed Circuit Boards (PCBs). Fluorescent Appearance Enabling visual detection under Ultraviolet (UV) light.