Hapco, Inc. Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
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Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/17
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/30 Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/40 Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7 |
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on... |
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Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4701 Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4951 |
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress... |