Hapco, Inc. Datasheets for Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more

Product Name Notes
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/17
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/30
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/40
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on...
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4701
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4951
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress...