Wakefield Thermal, Inc. Thermal Adhesive/Compound/Material 175-6-220P

Description
The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for semi - conductor interface to heat sinks. Their properties eliminate messy concerns associated with thermal greases.
Request a Quote Datasheet
Description
The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for semi - conductor interface to heat sinks. Their properties eliminate messy concerns associated with thermal greases.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Adhesive/Compound/Material - 175-6-220P - Richardson RFPD
Downers Grove, IL, United States
Thermal Adhesive/Compound/Material
175-6-220P
Thermal Adhesive/Compound/Material 175-6-220P
The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for semi - conductor interface to heat sinks. Their properties eliminate messy concerns associated with thermal greases.

The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for semi - conductor interface to heat sinks. Their properties eliminate messy concerns associated with thermal greases.

Supplier's Site Datasheet
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal - 46F7847 - Newark, An Avnet Company
Chicago, IL, United States
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
46F7847
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 46F7847
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials Thermal Compounds and Thermal Interface Materials
Product Number 175-6-220P 46F7847
Product Name Thermal Adhesive/Compound/Material Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system - EP39MAOHT - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Potting Compound Solutions for PCBAs - Electrolube ® UR5097 Thermally Conductive Polyurethane Potting Compound - MacDermid Alpha Electronics Solutions
Specs
Chemical System Polyurethane
Industry Electronics; Semiconductors, IC's
Features Electrically Conductive; Flame Retardant
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details