SARCON® PG65A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also helps reduce stress on the PCB during assembly.
-Thermal conductivity of 6.5 W/m°K.
-Thicknesses from 0.3mm to 2mm
-Improves cooling performance by completely filling small and unwanted air gaps
-Available in precut dimensions up to 300mm x 200mm
-Can be die-cut to fit almost any application shape.
| Fujipoly® America Corp. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | SARCON®PG65A |
| Product Name | Thermal Interface Material- Gap Filler Pads (Putty) |
| Chemical System | Silicone |
| Features | Gap Filler, Foam in Place Gasket; Thermally Conductive |
| Industry | Aerospace; Automotive; Electronics; OEM or Industrial |
| Use Temperature | -40 to 302 F (-40 to 150 C) |
