Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components. Product Benefits • No mixing required (eliminates errors in mixing ratio) • Room temperature cure. No heat required. • Eliminates screws and rivets for assembly. • Eliminates the air space between components. • High k factor for heat conductive application
| Hernon Manufacturing, Inc. | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | 745D |
| Product Name | Formulations - Applications - Thermally Conductive - DISSIPATOR 745D |
| Cure / Technology | Room Temperature Vulcanizing or Curing |