Techsil Limited tecbond® OverTec 5FR Black 6 Sticks PAHM20004

Description
OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component casting/potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and dielectric strength. The Overtec system is a low-pressure molding process that uses thermoplastic molding resin to achieve high quality sealing and protection of components, faster than 2 component potting resins and far lower capital cost than injection molding. Positioned between casting and injection molding technologies, this innovation allows fragile or delicate components to be encapsulated and protected with no risk of damage. The OverTec 5FR resin sticks simply need to be loaded into the OverTec 820-15 glue gun and allowed to reach operating temperature before use, resulting in a simple and clean process with fast cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more.
Description
OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component casting/potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and dielectric strength. The Overtec system is a low-pressure molding process that uses thermoplastic molding resin to achieve high quality sealing and protection of components, faster than 2 component potting resins and far lower capital cost than injection molding. Positioned between casting and injection molding technologies, this innovation allows fragile or delicate components to be encapsulated and protected with no risk of damage. The OverTec 5FR resin sticks simply need to be loaded into the OverTec 820-15 glue gun and allowed to reach operating temperature before use, resulting in a simple and clean process with fast cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more.

Suppliers

Company
Product
Description
Supplier Links
tecbond® OverTec 5FR Black 6 Sticks - PAHM20004 - Techsil Limited
Bidford on Avon, United Kingdom
tecbond® OverTec 5FR Black 6 Sticks
PAHM20004
tecbond® OverTec 5FR Black 6 Sticks PAHM20004
OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component casting/potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and dielectric strength. The Overtec system is a low-pressure molding process that uses thermoplastic molding resin to achieve high quality sealing and protection of components, faster than 2 component potting resins and far lower capital cost than injection molding. Positioned between casting and injection molding technologies, this innovation allows fragile or delicate components to be encapsulated and protected with no risk of damage. The OverTec 5FR resin sticks simply need to be loaded into the OverTec 820-15 glue gun and allowed to reach operating temperature before use, resulting in a simple and clean process with fast cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more.

OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component casting/potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and dielectric strength. The Overtec system is a low-pressure molding process that uses thermoplastic molding resin to achieve high quality sealing and protection of components, faster than 2 component potting resins and far lower capital cost than injection molding. Positioned between casting and injection molding technologies, this innovation allows fragile or delicate components to be encapsulated and protected with no risk of damage. The OverTec 5FR resin sticks simply need to be loaded into the OverTec 820-15 glue gun and allowed to reach operating temperature before use, resulting in a simple and clean process with fast cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more.

Supplier's Site

Technical Specifications

  Techsil Limited
Product Category Encapsulants and Potting Compounds
Product Number PAHM20004
Product Name tecbond® OverTec 5FR Black 6 Sticks
Form / Function Pellets
Unlock Full Specs
to access all available technical data

Similar Products

One Component, UV and Heat Curable Epoxy - UV15DC80 - Master Bond, Inc.
Specs
Type High Dielectric; Optical; Thermal Insulation
Form / Function Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
Cure / Technology Thermoset; UV or Radiation Cured; Single Component
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Type Thermally Conductive
Cure / Technology Two Component  ; Addition
Features Flame Retardant; UL Rating
View Details
Formulations - Applications - Potting Epoxies - TUFFBOND 397 - TUFFBOND 397H - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
ELAN-Tron® - U 510S-6 Thixo Resin / UH 510S Hardener - ELANTAS North America LLC
Specs
Type High Dielectric
Form / Function Liquid
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
View Details