Technic's MP200 is a vertical plater that solves the problems with transport of thin materials in either roll or sheet form. It’s no touch transport stops handling defects from occurring and production proven cell design yields unsurpassed plating distribution.
The Technic MP200 is an advanced VCP design for plating of thin substrates in panel, cut sheet or roll. The equipment can be adapted to seed layer plating as well as panel or pattern plating of copper, tin, nickel and or gold. The Technic MP200 perfects the VCP concept and provides:
| Technic, Inc. | Technic, Inc. | |
|---|---|---|
| Product Category | Thin Film Equipment | Thin Film Equipment |
| Product Number | Technic MP200 | Technic MP200 |
| Product Name | Vertical Copper Plating System | Advanced Vertical Plating for Thin Substrates |
| Applications | Electronics, Printed Circuit Boards (PCB) | Plastic Films, Foils and Thin Substrates |
