Contact Features Contact Base Material : Beryllium Copper Contact Length : 36.58 MM [1.44 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 - 2.03 MICM [50 - 100 MICIN ] Contact Retention Within Housing : With Contact Size : Size 22 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Contact Features Contact Base Material : Beryllium Copper Contact Length : 36.58 MM [1.44 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 - 2.03 MICM [50 - 100 MICIN ] Contact Retention Within Housing : With Contact Size : Size 22 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features Contact Base Material : Beryllium Copper Contact Length : 36.58 MM [1.44 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 - 2.03 MICM [50 - 100 MICIN ] Contact Retention Within Housing : With Contact Size : Size 22 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features
Contact Base Material : Beryllium Copper
Contact Length : 36.58 MM [1.44 INCH ]
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : 1.27 - 2.03 MICM [50 - 100 MICIN ]
Contact Retention Within Housing : With
Contact Size : Size 22
Contact Type : Pin
Identification Marking
Contact Color Code : None
Mechanical Attachment
Contact Retention Type Within Housing : Retention Clip
Packaging Features
Packaging Method : Tray
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Printed Circuit Board : Through Hole - Solder
