Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSSC3018BA2D ES

Description
DICE (WAFER SAWN) - WAFFLE PACK
  • Interface - Sensor and Detector Interfaces - ZSSC3018BA2D ES - Lingto Electronic Limited
    Lingto Electronic Limited
  • Sensor and Detector Interfaces - ZSSC3018BA2D ES - ODG (Origin Data Global)
    ODG (Origin Data Global)
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSSC3018BA2D ES - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3018BA2D ES
Interface - Sensor and Detector Interfaces ZSSC3018BA2D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet
Sensor and Detector Interfaces - ZSSC3018BA2D ES - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Sensor and Detector Interfaces
ZSSC3018BA2D ES
Sensor and Detector Interfaces ZSSC3018BA2D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited ODG (Origin Data Global)
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3018BA2D ES ZSSC3018BA2D ES
Product Name Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface
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