QUALCOMM, Incorporated Bluetooth Chipset QCC3 Series

Description
Entry-level, flash programmable audio platform These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically been associated with fixed function ROM devices. The QCC3XXX family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing high quality Bluetooth audio products. More consumers are making the move to wireless due to disruptive industry events like the removal of the headphone jack. The introduction of this platform means that consumers can benefit from technologies like Qualcomm® aptX™ audio in lower cost Qualcomm TrueWireless™ Stereo headsets. We are helping our customers to offer a wider range of what were once premium features at a highly competitive price point, which also can expand the overall industry and potential unit sales.
Description
Entry-level, flash programmable audio platform These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically been associated with fixed function ROM devices. The QCC3XXX family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing high quality Bluetooth audio products. More consumers are making the move to wireless due to disruptive industry events like the removal of the headphone jack. The introduction of this platform means that consumers can benefit from technologies like Qualcomm® aptX™ audio in lower cost Qualcomm TrueWireless™ Stereo headsets. We are helping our customers to offer a wider range of what were once premium features at a highly competitive price point, which also can expand the overall industry and potential unit sales.

Suppliers

Company
Product
Description
Supplier Links
Bluetooth Chipset - QCC3 Series - QUALCOMM, Incorporated
San Diego, CA, USA
Bluetooth Chipset
QCC3 Series
Bluetooth Chipset QCC3 Series
Entry-level, flash programmable audio platform These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically been associated with fixed function ROM devices. The QCC3XXX family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing high quality Bluetooth audio products. More consumers are making the move to wireless due to disruptive industry events like the removal of the headphone jack. The introduction of this platform means that consumers can benefit from technologies like Qualcomm® aptX™ audio in lower cost Qualcomm TrueWireless™ Stereo headsets. We are helping our customers to offer a wider range of what were once premium features at a highly competitive price point, which also can expand the overall industry and potential unit sales.

Entry-level, flash programmable audio platform

These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically been associated with fixed function ROM devices. The QCC3XXX family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing high quality Bluetooth audio products.

More consumers are making the move to wireless due to disruptive industry events like the removal of the headphone jack. The introduction of this platform means that consumers can benefit from technologies like Qualcomm® aptX™ audio in lower cost Qualcomm TrueWireless™ Stereo headsets. We are helping our customers to offer a wider range of what were once premium features at a highly competitive price point, which also can expand the overall industry and potential unit sales.

Supplier's Site

Technical Specifications

  QUALCOMM, Incorporated
Product Category Network and Communication Chips
Product Number QCC3 Series
Product Name Bluetooth Chipset
Technology Bluetooth
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