NTE Electronics, Inc. Thermal Insulators, Thermo Pad, Do-4; Insulator Body Material Nte Electronics TP0003

Description
THERMAL INSULATORS, THERMO PAD, DO-4; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m. K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes
  • Thermal Insulators, Thermo Pad, Do-4; Insulator Body Material Nte Electronics - 31C6210 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL INSULATORS, THERMO PAD, DO-4; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m. K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Insulators, Thermo Pad, Do-4; Insulator Body Material Nte Electronics - 31C6210 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Insulators, Thermo Pad, Do-4; Insulator Body Material Nte Electronics
31C6210
Thermal Insulators, Thermo Pad, Do-4; Insulator Body Material Nte Electronics 31C6210
THERMAL INSULATORS, THERMO PAD, DO-4; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m. K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes

THERMAL INSULATORS, THERMO PAD, DO-4; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 31C6210
Product Name Thermal Insulators, Thermo Pad, Do-4; Insulator Body Material Nte Electronics
Thermal Conductivity 0.9000 W/m-K (0.5200 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Ripley™
E 468-2-7-55F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Flexible, Two Component Silver Conductive Epoxy - EP21TDCSFL - Master Bond, Inc.
Master Bond, Inc.
Flexible, Two Component Silver Conductive Epoxy
EP21TDCSFL
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Two-component insulation thermal conductive gel for PCB - SE800AB - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Two-component insulation thermal conductive gel for PCB
SE800AB
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details