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Fujipoly® America Corp. Gap Filler Pads (Electromagnetic Wave Absorption) SARCON EGR30A

  • Gap Filler Pads (Electromagnetic Wave Absorption) - SARCON EGR30A - Fujipoly® America Corp.
    Fujipoly® America Corp.
Description
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave Features Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to simply insert the product between circuit board. Self-adhesive gel surface does not require any adhesive tape for assembly.
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Suppliers

Company
Product
Description
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Gap Filler Pads (Electromagnetic Wave Absorption) - SARCON EGR30A - Fujipoly® America Corp.
Fujipoly® America Corp.
Carteret, NJ, United States
Gap Filler Pads (Electromagnetic Wave Absorption)
SARCON EGR30A
Gap Filler Pads (Electromagnetic Wave Absorption) SARCON EGR30A
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave Features Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to simply insert the product between circuit board. Self-adhesive gel surface does not require any adhesive tape for assembly.

Silicone Gap Filler Pad for Absorption of Electromagnetic Wave

Features

  • Effective to absorb and damp a wide range of electromagnetic waves.
  • Also effective as a high performance thermal interface material.
  • Easily filling small gaps of IC chip surface with soft gel texture.
  • Good workability to simply insert the product between circuit board.
  • Self-adhesive gel surface does not require any adhesive tape for assembly.
Supplier's Site Datasheet

Technical Specifications

  Fujipoly® America Corp.
Product Category Industrial Sealants
Product Number SARCON EGR30A
Product Name Gap Filler Pads (Electromagnetic Wave Absorption)
Chemical System Silicone
Features High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
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