PNP general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Features and benefits
High power dissipation capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
AEC-Q101 qualified
Applications
General-purpose switching and amplification
Space restricted applications
PNP general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Features and benefits
- High power dissipation capability
- Suitable for Automatic Optical Inspection (AOI) of solder joint
- Smaller footprint compared to conventional leaded SMD packages
- Low package height of 0.5 mm
- AEC-Q101 qualified
Applications
- General-purpose switching and amplification
- Space restricted applications