Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Richardson RFPD
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Description
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Request a Quote
Email Supplier
Datasheet
Datasheet Summary Powered by GS/AI
The MSCSM120XM31CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module integrating Silicon Carbide MOSFETs and Schottky diodes for high-reliability motion control applications. It features an AlSiC base plate, Si₃N₄ substrate, and solderable terminals for direct heatsink mounting. The module has a 1200 V blocking voltage, continuous drain currents up to 80 A per SiC MOSFET, and pulsed collector currents up to 300 A for the soft-start IGBT. Thermal resistance values range from 0.332 °C/W for the soft-start IGBT to 3 °C/W for the solenoid SiC diodes. An internal PTC thermistor provides temperature monitoring. The device is rated for junction temperatures from -55 °C to 175 °C and has a 4000 V RMS isolation voltage. It complies with RoHS standards and weighs 150 g.
Datasheet Summary Powered by GS/AI
The MSCSM120XM31CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module integrating Silicon Carbide MOSFETs and Schottky diodes for high-reliability motion control applications. It features an AlSiC base plate, Si₃N₄ substrate, and solderable terminals for direct heatsink mounting. The module has a 1200 V blocking voltage, continuous drain currents up to 80 A per SiC MOSFET, and pulsed collector currents up to 300 A for the soft-start IGBT. Thermal resistance values range from 0.332 °C/W for the soft-start IGBT to 3 °C/W for the solenoid SiC diodes. An internal PTC thermistor provides temperature monitoring. The device is rated for junction temperatures from -55 °C to 175 °C and has a 4000 V RMS isolation voltage. It complies with RoHS standards and weighs 150 g.
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
