CuPacks™ by Materion Microelectronics and Services deliver outstanding performance for cutting edge, high power Si and GaN transistors, and meet the industry’s demands for low thermal resistance and low RF loss.
These unique packages feature 0.2 mm thick copper leads and base, as well as an alumina ceramic ringframe. CuPacks™ are electrolytically plated with nickel and gold and are compatible with a wide range of die attach materials. CuPacks™ are surface mount packages with leads that can be formed in straight, gull wing or J-shaped configurations.
| Materion Corporation | |
|---|---|
| Product Category | Electroceramics |
| Product Number | CuPacks |
| Product Name | Microelectronic Ceramic Packages |
| Material Type | Ni + Au with AuSi or AuSn |
