MacDermid Alpha Electronics Solutions STAYSTIK ® 415

Description
Alumina Filled Dielectric Film Product Overview STAYSTIK 415 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 415 adhesive film can be used for die attach in solder sealed, hermetic packages and demonstrates low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives. Features Meets MIL STD 883 requirements Extremely low outgassing Fast bonding to a variety of substrates
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Description
Alumina Filled Dielectric Film Product Overview STAYSTIK 415 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 415 adhesive film can be used for die attach in solder sealed, hermetic packages and demonstrates low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives. Features Meets MIL STD 883 requirements Extremely low outgassing Fast bonding to a variety of substrates
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
STAYSTIK ® 415 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
STAYSTIK ® 415
STAYSTIK ® 415
Alumina Filled Dielectric Film Product Overview STAYSTIK 415 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 415 adhesive film can be used for die attach in solder sealed, hermetic packages and demonstrates low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives. Features Meets MIL STD 883 requirements Extremely low outgassing Fast bonding to a variety of substrates

Alumina Filled Dielectric Film

Product Overview

STAYSTIK 415 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. STAYSTIK 415 adhesive film can be used for die attach in solder sealed, hermetic packages and demonstrates low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives.


Features

  • Meets MIL STD 883 requirements
  • Extremely low outgassing
  • Fast bonding to a variety of substrates
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Electroceramics
Product Name STAYSTIK ® 415
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