Master Bond, Inc. Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life EP110F8-5

Description
Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists thermal cycling, and provides dimensional stability.
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Description
Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists thermal cycling, and provides dimensional stability.
Request a Quote

Suppliers

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Product
Description
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Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life - EP110F8-5 - Master Bond, Inc.
Hackensack, NJ, USA
Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
EP110F8-5
Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life EP110F8-5
Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists thermal cycling, and provides dimensional stability.

Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists thermal cycling, and provides dimensional stability.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP110F8-5
Product Name Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
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