Master Bond, Inc. Low Viscosity, Two Component Epoxy EP30-1

Description
Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low-0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A). Master Bond Polymer System EP30-1 produces high strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.
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Description
Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low-0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A). Master Bond Polymer System EP30-1 produces high strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.
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Suppliers

Company
Product
Description
Supplier Links
Low Viscosity, Two Component Epoxy - EP30-1 - Master Bond, Inc.
Hackensack, NJ, USA
Low Viscosity, Two Component Epoxy
EP30-1
Low Viscosity, Two Component Epoxy EP30-1
Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low-0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A). Master Bond Polymer System EP30-1 produces high strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low-0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A). Master Bond Polymer System EP30-1 produces high strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP30-1
Product Name Low Viscosity, Two Component Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Features High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
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