- Trained on our vast library of engineering resources.

Master Bond, Inc. No Mix, Thermally Conductive Epoxy Adhesive EP3RR-80

Description
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
No Mix, Thermally Conductive Epoxy Adhesive - EP3RR-80 - Master Bond, Inc.
Hackensack, NJ, USA
No Mix, Thermally Conductive Epoxy Adhesive
EP3RR-80
No Mix, Thermally Conductive Epoxy Adhesive EP3RR-80
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability.

Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP3RR-80
Product Name No Mix, Thermally Conductive Epoxy Adhesive
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
Features High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
Unlock Full Specs
to access all available technical data

Similar Products

High Tempreature and Thermal Cycling Resistant Epoxy - EP33 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details
Two Component Flame Retardant FAR Approved Epoxy Adhesive - EP90FR-V - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
Flowable Silicone Offers Thermal Cycling and Shock Resistance - MasterSil 323 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Silicone
View Details
Epoxy  Has Low Thermal Expansion Coefficient - EP30LTE - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details