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Master Bond, Inc. Thermally Conductive Room temperature Curing Epoxy EP21AN

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Thermally Conductive Room temperature Curing Epoxy - EP21AN - Master Bond, Inc.
Hackensack, NJ, USA
Thermally Conductive Room temperature Curing Epoxy
EP21AN
Thermally Conductive Room temperature Curing Epoxy EP21AN
Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1700 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP21ANLV is also available. The flowability of that system makes it an excellent thermally conductive potting compound.

Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1700 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP21ANLV is also available. The flowability of that system makes it an excellent thermally conductive potting compound.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP21AN
Product Name Thermally Conductive Room temperature Curing Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy
Composition Filled
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