MACOM RF and Microwave Switch MA4SW510B-1

Description
The MA4SW510B-1 is a SP5T Series-Shunt broad band switch with integrated bias networks made with MACOM's HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent 5, 268, 310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or bias by imbedding them in low loss glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through 18 GHz. Applications These high performance switches are suitable for the use in multiband ECM, Radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5 V/-5 V, TTL controlled PIN diode driver, 80 ns switching speeds are achieved.
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Description
The MA4SW510B-1 is a SP5T Series-Shunt broad band switch with integrated bias networks made with MACOM's HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent 5, 268, 310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or bias by imbedding them in low loss glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through 18 GHz. Applications These high performance switches are suitable for the use in multiband ECM, Radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5 V/-5 V, TTL controlled PIN diode driver, 80 ns switching speeds are achieved.
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Suppliers

Company
Product
Description
Supplier Links
RF and Microwave Switch - MA4SW510B-1 - Richardson RFPD
Downers Grove, IL, United States
RF and Microwave Switch
MA4SW510B-1
RF and Microwave Switch MA4SW510B-1
The MA4SW510B-1 is a SP5T Series-Shunt broad band switch with integrated bias networks made with MACOM's HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent 5, 268, 310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or bias by imbedding them in low loss glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through 18 GHz. Applications These high performance switches are suitable for the use in multiband ECM, Radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5 V/-5 V, TTL controlled PIN diode driver, 80 ns switching speeds are achieved.

The MA4SW510B-1 is a SP5T Series-Shunt broad band switch with integrated bias networks made with MACOM's HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent 5, 268, 310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or bias by imbedding them in low loss glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through 18 GHz. Applications These high performance switches are suitable for the use in multiband ECM, Radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5 V/-5 V, TTL controlled PIN diode driver, 80 ns switching speeds are achieved.

Supplier's Site Datasheet
RF Switches - 1465-1055-ND - DigiKey
Thief River Falls, MN, United States
RF Switches
1465-1055-ND
RF Switches 1465-1055-ND
RF Switch IC General Purpose SP5T 18GHz Die

RF Switch IC General Purpose SP5T 18GHz Die

Buy Now Datasheet
RF Switches - MA4SW510B-1 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RF Switches
MA4SW510B-1
RF Switches MA4SW510B-1
RF Switch IC General Purpose SP5T 18 GHz Die

RF Switch IC General Purpose SP5T 18 GHz Die

Buy Now Datasheet

Technical Specifications

  Richardson RFPD DigiKey Quarktwin Technology Ltd.
Product Category RF Switches RF Switches RF Switches
Product Number MA4SW510B-1 1465-1055-ND MA4SW510B-1
Product Name RF and Microwave Switch RF Switches RF Switches
Package Type Die Die
Frequency Range 2000 to 18000 MHz 2000 to 18000 MHz 2000 to 18000 MHz
Insertion Loss 1.8 dB 1.8 dB 1.8 dB
Isolation 35 dB 35 dB 35 dB
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