MACOM RF & MW Power Amplifier CMPA2560025F

Description
CMPA2560025F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.
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Description
CMPA2560025F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.
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Suppliers

Company
Product
Description
Supplier Links
RF & MW Power Amplifier - CMPA2560025F - Richardson RFPD
Downers Grove, IL, United States
RF & MW Power Amplifier
CMPA2560025F
RF & MW Power Amplifier CMPA2560025F
CMPA2560025F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.

CMPA2560025F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.

Supplier's Site
RF Amplifiers - 1465-CMPA2560025F-ND - DigiKey
Thief River Falls, MN, United States
RF Amplifier IC 2.5GHz ~ 6GHz 780019

RF Amplifier IC 2.5GHz ~ 6GHz 780019

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RF and Wireless - RF Amplifiers - CMPA2560025F - Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - RF Amplifiers
CMPA2560025F
RF and Wireless - RF Amplifiers CMPA2560025F
IC RF AMP 2.5GHZ-6GHZ 780019

IC RF AMP 2.5GHZ-6GHZ 780019

Supplier's Site

Technical Specifications

  Richardson RFPD DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category RF Amplifiers RF Amplifiers RF Amplifiers
Product Number CMPA2560025F 1465-CMPA2560025F-ND CMPA2560025F
Product Name RF & MW Power Amplifier RF Amplifiers RF and Wireless - RF Amplifiers
Amplifier Type Power Amplifier Low Noise Amplifier; Power Amplifier
Frequency Range 2500 to 6000 MHz 2500 to 6000 MHz 2500 to 6000 MHz
Maximum Gain 24.3 dB 24 dB 24 dB
Package Type Screw-down 780019
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