MACOM RF & MW Power Amplifier CMPA2060035F

Description
CMPA2060035F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.
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Description
CMPA2060035F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.
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Suppliers

Company
Product
Description
Supplier Links
RF & MW Power Amplifier - CMPA2060035F - Richardson RFPD
Downers Grove, IL, United States
RF & MW Power Amplifier
CMPA2060035F
RF & MW Power Amplifier CMPA2060035F
CMPA2060035F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.

CMPA2060035F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a Copper-Tungsten heat-sink.

Supplier's Site
RF Amplifiers - 1465-CMPA2060035F-ND - DigiKey
Thief River Falls, MN, United States
RF Amplifier IC 2GHz ~ 6GHz 440219

RF Amplifier IC 2GHz ~ 6GHz 440219

Buy Now Datasheet
RF and Wireless - RF Amplifiers - CMPA2060035F - Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - RF Amplifiers
CMPA2060035F
RF and Wireless - RF Amplifiers CMPA2060035F
IC RF AMP 2GHZ-6GHZ 440219

IC RF AMP 2GHZ-6GHZ 440219

Supplier's Site

Technical Specifications

  Richardson RFPD DigiKey Acme Chip Technology Co., Limited
Product Category RF Amplifiers RF Amplifiers RF Amplifiers
Product Number CMPA2060035F 1465-CMPA2060035F-ND CMPA2060035F
Product Name RF & MW Power Amplifier RF Amplifiers RF and Wireless - RF Amplifiers
Amplifier Type Power Amplifier Low Noise Amplifier; Power Amplifier
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