Parker Lord CoolTherm® ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand 260 °C peak reflow temperatures of lead-free solders. 10 cc Syringe.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | ME-543 10CC EFD (8GM) |
| Product Name | Parker Lord CoolTherm® ME-543 Epoxy Encapsulant Black 10 cc Syringe |
| Cure / Technology | Single Component |
