Littelfuse, Inc. Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYK110N120A4

Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages
Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages
Datasheet
Datasheet Summary
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The IXYK110N120A4 is a 1200V XPT Trench IGBT designed for switching applications up to 5 kHz. It is housed in a TO-264 package and has a continuous collector current rating of 110 A at 110⁰C. The device features a maximum collector-emitter saturation voltage of 1.80 V at 110 A and 15 V gate-emitter voltage, with a junction temperature range of -55⁰C to 175⁰C. Thermal resistance from junction to case is 0.11 ⁰C/W, and it supports a peak pulse current of 900 A for 1 ms. The IGBT exhibits a positive thermal coefficient for collector-emitter voltage, enabling parallel operation, and meets international standard packaging requirements.

Datasheet Summary
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The IXYK110N120A4 is a 1200V XPT Trench IGBT designed for switching applications up to 5 kHz. It is housed in a TO-264 package and has a continuous collector current rating of 110 A at 110⁰C. The device features a maximum collector-emitter saturation voltage of 1.80 V at 110 A and 15 V gate-emitter voltage, with a junction temperature range of -55⁰C to 175⁰C. Thermal resistance from junction to case is 0.11 ⁰C/W, and it supports a peak pulse current of 900 A for 1 ms. The IGBT exhibits a positive thermal coefficient for collector-emitter voltage, enabling parallel operation, and meets international standard packaging requirements.

Suppliers

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Product
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Supplier Links
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs - IXYK110N120A4 - Littelfuse, Inc.
Rosemont, IL, United States
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
IXYK110N120A4
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYK110N120A4
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages

Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYK110N120A4
Product Name Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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