Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH50N65C3D1 IXYH50N65C3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYH50N65C3D1 is a 650V, 50A IGBT with an anti-parallel fast diode, designed for switching applications between 20 and 60 kHz. It is packaged in a TO-247 case and weighs 6 grams. The device features a low gate drive requirement, square reverse bias safe operating area, avalanche capability, and short circuit tolerance. It has a maximum collector current of 50 A at 110°C, a collector-emitter saturation voltage of 2.10 V at 36 A and 15 V gate drive, and a thermal resistance junction-to-case of 0.21 °C/W. The IGBT meets international standard package requirements and is rated for junction temperatures from -55°C to 175°C.

Datasheet Summary
Powered by GS/AI

The IXYH50N65C3D1 is a 650V, 50A IGBT with an anti-parallel fast diode, designed for switching applications between 20 and 60 kHz. It is packaged in a TO-247 case and weighs 6 grams. The device features a low gate drive requirement, square reverse bias safe operating area, avalanche capability, and short circuit tolerance. It has a maximum collector current of 50 A at 110°C, a collector-emitter saturation voltage of 2.10 V at 36 A and 15 V gate drive, and a thermal resistance junction-to-case of 0.21 °C/W. The IGBT meets international standard package requirements and is rated for junction temperatures from -55°C to 175°C.

Suppliers

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Product
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Supplier Links
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH50N65C3D1 - IXYH50N65C3D1 - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH50N65C3D1
IXYH50N65C3D1
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH50N65C3D1 IXYH50N65C3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYH50N65C3D1
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH50N65C3D1
VCES 650 volts
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