Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYH40N65C3H1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYH40N65C3H1 is a 650 V XPT™ IGBT with an integrated anti-parallel sonic diode, designed for switching applications between 20 and 60 kHz. It is packaged in a TO-247-3L case with dimensions of 20.79-21.45 mm in length and 15.48-16.24 mm in width. The device has a continuous collector current rating of 40 A at 110 °C and a collector-emitter saturation voltage of 2.00-2.35 V at 40 A and 15 V gate drive. It supports short-circuit operation for 5 µs and is rated for non-repetitive avalanche energy up to 300 mJ. Thermal resistance from junction to case is 0.50 °C/W for the IGBT and 0.60 °C/W for the diode. The device features a square RBSOA and is avalanche-rated.

Datasheet Summary
Powered by GS/AI

The IXYH40N65C3H1 is a 650 V XPT™ IGBT with an integrated anti-parallel sonic diode, designed for switching applications between 20 and 60 kHz. It is packaged in a TO-247-3L case with dimensions of 20.79-21.45 mm in length and 15.48-16.24 mm in width. The device has a continuous collector current rating of 40 A at 110 °C and a collector-emitter saturation voltage of 2.00-2.35 V at 40 A and 15 V gate drive. It supports short-circuit operation for 5 µs and is rated for non-repetitive avalanche energy up to 300 mJ. Thermal resistance from junction to case is 0.50 °C/W for the IGBT and 0.60 °C/W for the diode. The device features a square RBSOA and is avalanche-rated.

Suppliers

Company
Product
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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYH40N65C3H1 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYH40N65C3H1
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYH40N65C3H1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYH40N65C3H1
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 650 volts
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