Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYA20N65C3D1 IXYA20N65C3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYA20N65C3D1 is a 650 V, 20 A silicon IGBT in a TO-263 AA package with an integrated fast anti-parallel diode, designed for 20-60 kHz switching applications. It has a maximum collector current of 20 A at 110°C, a collector-emitter saturation voltage of 2.50 V at 20 A and 15 V gate-emitter voltage, and a maximum junction temperature of 175°C. The device is avalanche-rated, has square RBSOA, and short-circuit capability. The TO-263 AA package measures 15.88 mm in lead length, 10.41 mm in body width, and weighs 2.5 g. Mounting torque for the TO-263 package is 10-65 N (2.2-14.6 lb). Thermal resistance from junction to case is 0.65 °C/W.

Datasheet Summary
Powered by GS/AI

The IXYA20N65C3D1 is a 650 V, 20 A silicon IGBT in a TO-263 AA package with an integrated fast anti-parallel diode, designed for 20-60 kHz switching applications. It has a maximum collector current of 20 A at 110°C, a collector-emitter saturation voltage of 2.50 V at 20 A and 15 V gate-emitter voltage, and a maximum junction temperature of 175°C. The device is avalanche-rated, has square RBSOA, and short-circuit capability. The TO-263 AA package measures 15.88 mm in lead length, 10.41 mm in body width, and weighs 2.5 g. Mounting torque for the TO-263 package is 10-65 N (2.2-14.6 lb). Thermal resistance from junction to case is 0.65 °C/W.

Suppliers

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Product
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Supplier Links
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYA20N65C3D1 - IXYA20N65C3D1 - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYA20N65C3D1
IXYA20N65C3D1
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYA20N65C3D1 IXYA20N65C3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYA20N65C3D1
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYA20N65C3D1
VCES 650 volts
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