Laird Technologies Pads, Sheets, Bridges A10098-01

Description
Thermal Pad Gray 203.20mm x 203.20mm Square
Request a Quote Datasheet
Description
Thermal Pad Gray 203.20mm x 203.20mm Square
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - A10098-01-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
A10098-01-ND
Pads, Sheets, Bridges A10098-01-ND
Thermal Pad Gray 203.20mm x 203.20mm Square

Thermal Pad Gray 203.20mm x 203.20mm Square

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Leveling and Filling Compounds
Product Number A10098-01-ND
Product Name Pads, Sheets, Bridges
Thermal Conductivity 6 W/m-K (3.47 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Room Temperature Curing Epoxy Features Low Thermal Resistance - EP30TC - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Composition Filled
View Details
Fillers & Putties - 4479719 - RS Components, Ltd.
RS Components, Ltd.
Specs
Type / Form Liquid
Features Sealant
Use Temperature 122 F (50 C)
View Details
ALPHA ® HiTech ® CU21-3240 Underfill -  - MacDermid Alpha Electronics Solutions
Specs
Industry Automotive; Electronics
View Details
Phase Change Materials - BERGQUIST HI FLOW THF 1000F-AC - Henkel Corporation - Industrial
Specs
Features Adhesive
Use Temperature 248 F (120 C)
Thermal Conductivity 1 W/m-K (0.5778 BTU-ft/hr-ft²-F)
View Details