A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability.
Product Overview
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
It is a high glass transition temperature [Tg] and low coefficient thermal expansion [CTE] underfill. These features result in a high reliability solution.
Product Features
Provides full component coverage when dispensed onto the substrate preheated at 70 - 100°C
High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
Excellent Thermal Cycling Test performance
Halogen-free and complies with RoHS Directive 2015/863/EU
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability.
Product Overview
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
It is a high glass transition temperature [Tg] and low coefficient thermal expansion [CTE] underfill. These features result in a high reliability solution.
Product Features
- Provides full component coverage when dispensed onto the substrate preheated at 70 - 100°C
- High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
- Excellent Thermal Cycling Test performance
- Halogen-free and complies with RoHS Directive 2015/863/EU
