Koford Engineering, LLC Epoxy Adhesive E111

Description
E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding magnets andother applications where dissimilar materials are bonded and must withstand long term thermal cycling andthe 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strength and longterm durability then modified acrylic adhesives or conventional epoxies. Has good adhesion to plastics aswell as metal and ceramics. Due to the aluminum filler the minimum bondline gap is approximately .002"to .003".
Datasheet
Description
E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding magnets andother applications where dissimilar materials are bonded and must withstand long term thermal cycling andthe 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strength and longterm durability then modified acrylic adhesives or conventional epoxies. Has good adhesion to plastics aswell as metal and ceramics. Due to the aluminum filler the minimum bondline gap is approximately .002"to .003".
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Winchester, OH, USA
Epoxy Adhesive
E111
Epoxy Adhesive E111
E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding magnets andother applications where dissimilar materials are bonded and must withstand long term thermal cycling andthe 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strength and longterm durability then modified acrylic adhesives or conventional epoxies. Has good adhesion to plastics aswell as metal and ceramics. Due to the aluminum filler the minimum bondline gap is approximately .002"to .003".

E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding magnets andother applications where dissimilar materials are bonded and must withstand long term thermal cycling andthe 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strength and longterm durability then modified acrylic adhesives or conventional epoxies. Has good adhesion to plastics aswell as metal and ceramics. Due to the aluminum filler the minimum bondline gap is approximately .002"to .003".

Supplier's Site Datasheet

Technical Specifications

  Koford Engineering, LLC
Product Category Industrial Adhesives
Product Number E111
Product Name Epoxy Adhesive
Cure / Technology Thermoset; Single Component
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