Integrated Device Technology Sensor and Detector Interfaces ZSSC3154BA1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Sensor and Detector Interfaces - ZSSC3154BA1D - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3154BA1D
Sensor and Detector Interfaces ZSSC3154BA1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Buy Now Datasheet
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3154BA1D - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3154BA1D
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3154BA1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3154BA1D ZSSC3154BA1D
Product Name Sensor and Detector Interfaces Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
Device Type Storage Interface Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

RF Front End (LNA + PA) - 2312-QPF4506TR13-5KTR-ND - DigiKey
Specs
Device Type Front End
Package Type 16-QFN Exposed Pad
Pins 16 #
View Details
 - A4942GESTR-T - Rochester Electronics
Allegro MicroSystems Inc.
Specs
Features RoHS
Package Type QFN20
View Details
Interface - Modems - ICs and Modules - SI3015-BS - Lingto Electronic Limited
Specs
Device Type Sensor Interface
Package Type SOIC; 16-SOIC
View Details
2 suppliers
Analog Switches, Multiplexers, Demultiplexers - CD74HC4053PWR - ODG (Origin Data Global)
Specs
Supply Voltage Other; 2V ~ 6V
Operating Temperature -55 to 125 C (-67 to 257 F)
Package Type 16-TSSOP (0.173", 4.40mm Width)
View Details
2 suppliers