Integrated Device Technology Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3135BA1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3135BA1D - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3135BA1D
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3135BA1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site
Sensor and Detector Interfaces - ZSSC3135BA1D - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3135BA1D
Sensor and Detector Interfaces ZSSC3135BA1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Buy Now Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3135BA1D ZSSC3135BA1D
Product Name Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface Storage Interface
Unlock Full Specs
to access all available technical data

Similar Products

Specs
Device Type Laser Driver
Features RoHS
Data Rate 2.15E7 kbps
View Details
Type 38.21 - Timed interface modules - EMR & SSR - 382102409024 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
 - 26LS32DM/B - Rochester Electronics
Specs
Technology RS422
Package Type DIP; CDIP; CDIP16
View Details
2 suppliers