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RS Components, Ltd. 555187

Description
No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux Type = Resin Product Weight = 500g Percent Copper = 0.5%
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Product
Description
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 - 555187 - RS Components, Ltd.
Corby, Northants, United Kingdom
No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux Type = Resin Product Weight = 500g Percent Copper = 0.5%

No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free.
Product Form = Paste
Melting Point = +217 - +219°C
Percent Silver = 3%
Percent Tin = 96.5%
Flux Type = Resin
Product Weight = 500g
Percent Copper = 0.5%

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Technical Specifications

  RS Components, Ltd.
Product Category Filler Alloys and Consumables
Product Number 555187
Joining Process / Product Form Braze or solder in the form of a paste.
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