MacDermid Alpha Electronics Solutions POLYSOLDER ® SE3001

Conductive adhesive cures with IR, convection, conduction, or vapor phase. Fast, low-temp curing, stable, reliable contact. Product Overview The material is cured by thermal processing in IR, convection, conduction, or vapor phase equipment. A combination of short cure time, low-temperature cure, and excellent thermal stability results in superior mechanical properties and stable contact resistance during stress tests and device operation. Overall, it is an electrically conductive adhesive with extremely low outgassing and fast bonding to a variety of substrates. Electrically Conductive Ensures reliable electrical connections in electronic assemblies. Fast Curing Can be cured quickly using thermal processing methods such as infrared (IR), convection, conduction, or vapor phase equipment. Low Outgassing Meets MIL-STD-883 requirements, making it suitable for sensitive applications.