ITW Devcon Devcon Potting & Encapsulating Compound - 1 lb - 10260 10260

Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 35 min working time. Works in a mix ratio of 3:1. Delivers great performance with a shear strength of 2680 psi.
Datasheet
Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 35 min working time. Works in a mix ratio of 3:1. Delivers great performance with a shear strength of 2680 psi.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Devcon Potting & Encapsulating Compound - 1 lb - 10260 - 078143-10260 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Devcon Potting & Encapsulating Compound - 1 lb - 10260
078143-10260
Devcon Potting & Encapsulating Compound - 1 lb - 10260 078143-10260
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 35 min working time. Works in a mix ratio of 3:1. Delivers great performance with a shear strength of 2680 psi.

Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 35 min working time. Works in a mix ratio of 3:1. Delivers great performance with a shear strength of 2680 psi.

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Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number 078143-10260
Product Name Devcon Potting & Encapsulating Compound - 1 lb - 10260
Dielectric Strength 25 kV/in (9.84 kV/cm)
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