Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
| Hernon Manufacturing, Inc. | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | 745PT |
| Product Name | Formulations - Applications - Thermally Conductive - Dissipator 745 |
| Cure / Technology | Room Temperature Vulcanizing or Curing |
