ELMA Electronic Inc. MicroTCA MicroSlim Backplane

Description
The Elma Electronic MicroSlim backplanes come in 1U and 3U formats. Features for the 1U version include slots for 6 AMC, 1 PM (Power Module), 1 MCH (MicroTCA Carrier Hub), 1 JSM (J-TAG Switch Module) and 2 CUs (Cooling Units). Compression-mount connectors are used in the backplane for increased reliability and superior (easier and more flexible) routing. Complies to MicroTCA.0 Specification Rev 1.0 Star and Dual Star Topology options Optimized via signal integrity studies Compression-mount connectors for improved performance, reliability and field replacement capability Active version has IPMB-0 intelligence for power and cooling unit installed across the backplane Active version has direct PCIe, GbE, XAUI and SATA connections
Datasheet
Description
The Elma Electronic MicroSlim backplanes come in 1U and 3U formats. Features for the 1U version include slots for 6 AMC, 1 PM (Power Module), 1 MCH (MicroTCA Carrier Hub), 1 JSM (J-TAG Switch Module) and 2 CUs (Cooling Units). Compression-mount connectors are used in the backplane for increased reliability and superior (easier and more flexible) routing. Complies to MicroTCA.0 Specification Rev 1.0 Star and Dual Star Topology options Optimized via signal integrity studies Compression-mount connectors for improved performance, reliability and field replacement capability Active version has IPMB-0 intelligence for power and cooling unit installed across the backplane Active version has direct PCIe, GbE, XAUI and SATA connections
Datasheet

Suppliers

Company
Product
Description
Supplier Links
MicroTCA MicroSlim Backplane -  - ELMA Electronic Inc.
Fremont, CA, USA
MicroTCA MicroSlim Backplane
MicroTCA MicroSlim Backplane
The Elma Electronic MicroSlim backplanes come in 1U and 3U formats. Features for the 1U version include slots for 6 AMC, 1 PM (Power Module), 1 MCH (MicroTCA Carrier Hub), 1 JSM (J-TAG Switch Module) and 2 CUs (Cooling Units). Compression-mount connectors are used in the backplane for increased reliability and superior (easier and more flexible) routing. Complies to MicroTCA.0 Specification Rev 1.0 Star and Dual Star Topology options Optimized via signal integrity studies Compression-mount connectors for improved performance, reliability and field replacement capability Active version has IPMB-0 intelligence for power and cooling unit installed across the backplane Active version has direct PCIe, GbE, XAUI and SATA connections

The Elma Electronic MicroSlim backplanes come in 1U and 3U formats. Features for the 1U version include slots for 6 AMC, 1 PM (Power Module), 1 MCH (MicroTCA Carrier Hub), 1 JSM (J-TAG Switch Module) and 2 CUs (Cooling Units). Compression-mount connectors are used in the backplane for increased reliability and superior (easier and more flexible) routing.

  • Complies to MicroTCA.0 Specification Rev 1.0
  • Star and Dual Star Topology options
  • Optimized via signal integrity studies
  • Compression-mount connectors for improved performance, reliability and field replacement capability
  • Active version has IPMB-0 intelligence for power and cooling unit installed across the backplane
  • Active version has direct PCIe, GbE, XAUI and SATA connections
Supplier's Site Datasheet

Technical Specifications

  ELMA Electronic Inc.
Product Category Backplanes
Product Name MicroTCA MicroSlim Backplane
Board Function Passive Backplane
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