ECS Inc. International Through Hole Crystals ECS-31X

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
Request a Quote
Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
Request a Quote
Datasheet
Datasheet Summary
Powered by GS/AI

The ECS-31X series comprises through-hole tuning fork crystals designed for low-frequency applications between 30 kHz and 150 kHz. The package measures 2x6 mm and operates over a temperature range of -10°C to +60°C with a turnover temperature of +25°C. The load capacitance is specified as 12.5 pF, with an equivalent series resistance of 50 kΩ and a drive level of 1.0 μW. Frequency tolerance at +25°C is ±30 ppm, and aging over the first year is ±5 ppm. The crystals are RoHS compliant, with an insulation resistance of 500 MΩ at 100 V DC and a soldering profile peaking at 260°C for 10 seconds. MSL rating is 1 with Sn/Cu matte lead finish.

Datasheet Summary
Powered by GS/AI

The ECS-31X series comprises through-hole tuning fork crystals designed for low-frequency applications between 30 kHz and 150 kHz. The package measures 2x6 mm and operates over a temperature range of -10°C to +60°C with a turnover temperature of +25°C. The load capacitance is specified as 12.5 pF, with an equivalent series resistance of 50 kΩ and a drive level of 1.0 μW. Frequency tolerance at +25°C is ±30 ppm, and aging over the first year is ±5 ppm. The crystals are RoHS compliant, with an insulation resistance of 500 MΩ at 100 V DC and a soldering profile peaking at 260°C for 10 seconds. MSL rating is 1 with Sn/Cu matte lead finish.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-31X - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-31X
Through Hole Crystals ECS-31X
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet

Technical Specifications

  ECS Inc. International
Product Category Crystals
Product Number ECS-31X
Product Name Through Hole Crystals
Package / Form Factor Through Hole Crystals
Unlock Full Specs
to access all available technical data

Similar Products

Crystals - X429-ND - DigiKey
ECS Inc. International
Specs
Package / Form Factor Through Hole; HC-49/US
Frequency Stability 50 ppm
Operating Temperature -10 to 70 C (14 to 158 F)
View Details
2 suppliers
Surface Mount Crystals - ECS-100-18-23B-JTM-TR - ECS Inc. International
Specs
Package / Form Factor Surface Mount
Features / Standards RoHS
Frequency 10 MHz
View Details
3 suppliers
Surface Mount Crystals - ECS-122.8-18-30-GM-TR - ECS Inc. International
Specs
Package / Form Factor Surface Mount
Features / Standards RoHS
Frequency 12.29 MHz
View Details
2 suppliers
Surface Mount Crystals - ECS-120-8-33B2-CTN-TR3 - ECS Inc. International
Specs
Package / Form Factor Surface Mount
Features / Standards RoHS
Frequency 12 MHz
View Details
2 suppliers