ECS Inc. International Through Hole Crystals ECS-120-18-9X

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
Request a Quote
Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
Request a Quote
Datasheet
Datasheet Summary
Powered by GS/AI

ECS-3X9X series miniature quartz crystals provide a frequency range of 4.00 to 70.00 MHz with a load capacitance of 16 pF typical, operating from -10 to +60 °C and offering ±50 ppm frequency stability over that range. The package is a 3x9 mm tubular design. These crystals support fundamental and third overtone modes, with equivalent series resistance up to 80 Ω for frequencies above 36 MHz. Drive level is rated between 50 and 100 μW, and insulation resistance exceeds 500 MΩ at 100 V DC. Aging is ±5 ppm maximum over the first year at +25 °C. The parts are RoHS compliant and suitable for reflow soldering with a peak temperature of +260 °C for 10 seconds. MSL is 1, with Sn/Cu matte lead finish.

Datasheet Summary
Powered by GS/AI

ECS-3X9X series miniature quartz crystals provide a frequency range of 4.00 to 70.00 MHz with a load capacitance of 16 pF typical, operating from -10 to +60 °C and offering ±50 ppm frequency stability over that range. The package is a 3x9 mm tubular design. These crystals support fundamental and third overtone modes, with equivalent series resistance up to 80 Ω for frequencies above 36 MHz. Drive level is rated between 50 and 100 μW, and insulation resistance exceeds 500 MΩ at 100 V DC. Aging is ±5 ppm maximum over the first year at +25 °C. The parts are RoHS compliant and suitable for reflow soldering with a peak temperature of +260 °C for 10 seconds. MSL is 1, with Sn/Cu matte lead finish.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-120-18-9X - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-120-18-9X
Through Hole Crystals ECS-120-18-9X
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet
Crystals - XC1380-ND - DigiKey
Thief River Falls, MN, United States
Crystals
XC1380-ND
Crystals XC1380-ND
12MHz ±50ppm Crystal 18pF 50 Ohms Cylindrical Can, Radial

12MHz ±50ppm Crystal 18pF 50 Ohms Cylindrical Can, Radial

Buy Now Datasheet
CRYSTAL 12.0000MHZ 18PF TH

CRYSTAL 12.0000MHZ 18PF TH

Supplier's Site

Technical Specifications

  ECS Inc. International DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category Crystals Crystals Crystals
Product Number ECS-120-18-9X XC1380-ND ECS-120-18-9X
Product Name Through Hole Crystals Crystals Crystals
Package / Form Factor Through Hole Crystals Through Hole; Cylindrical Can, Radial Through Hole
Features / Standards RoHS Lead-Free
Frequency 12 MHz 12 MHz
Frequency Stability 50 ppm 50 ppm
Unlock Full Specs
to access all available technical data

Similar Products

Surface Mount Crystals - ECS-128-13-30B-AEM-TR - ECS Inc. International
Specs
Package / Form Factor Surface Mount
Features / Standards RoHS
Frequency 12.8 MHz
View Details
3 suppliers
Through Hole Crystals - ECS-120-S-4X - ECS Inc. International
Specs
Package / Form Factor Through Hole Crystals
Features / Standards RoHS
Frequency 12 MHz
View Details
3 suppliers
Surface Mount Crystals - CSM-12 - ECS Inc. International
ECS Inc. International
Specs
Package / Form Factor Surface Mount
Features / Standards RoHS
Frequency 3.58 to 30 MHz
View Details
Through Hole Crystals - ECS-122.8-S-4X - ECS Inc. International
Specs
Package / Form Factor Through Hole Crystals
Features / Standards RoHS
Frequency 12.29 MHz
View Details
3 suppliers