Merrimac Industries, Inc. Standard F Package ILC-3F-2.0G

Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Datasheet
Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Standard F Package - ILC-3F-2.0G - Merrimac Industries, Inc.
West Caldwell, NJ, USA
Standard F Package
ILC-3F-2.0G
Standard F Package ILC-3F-2.0G
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Supplier's Site Datasheet

Technical Specifications

  Merrimac Industries, Inc.
Product Category RF Couplers
Product Number ILC-3F-2.0G
Product Name Standard F Package
RF Coupler Type Uni-Directional
Unlock Full Specs
to access all available technical data

Similar Products

Directional Coupler - 5o5655550 - 5o.com
Specs
RF Coupler Type Uni-Directional
Frequency Range 3000.00 to 4000.00 MHz
Power 300.00 watts
View Details
Specs
RF Coupler Type Bi-Directional
Frequency Range 2000.00 to 8000.00 MHz
Power 30.00 watts
View Details
500 to 3000MHz – Directional Coupler - UIYDCP18044A - UIY Inc.
Specs
Frequency Range 500.00 to 3000.00 MHz
Power 300.00 watts
Coupling 5.00 to 30.00 dB
View Details