Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
| Merrimac Industries, Inc. | Crane Aerospace & Electronics | |
|---|---|---|
| Product Category | RF Couplers | RF Couplers |
| Product Number | CSDZ-20H-1.9G | CSDZ-20H-1.9G |
| Product Name | Zapper® H Package | Directional Couplers |
| RF Coupler Type | Uni-Directional | Uni-Directional |
| Package Type | Surface Mount | Surface Mount; Surface Mount |
| Frequency Range | 1700.00 to 2000.00 MHz | 1700.00 to 2000.00 MHz |
| Directivity | 23.00 dB | 20.00 dB |
