OSLON Compact CL
Product Features
Package: Ceramic package
Feature of the device: small size high-flux LED for slim designs high robustness
Color: acc. to white area ECE/SAE
Viewing angle at 50 % IV: 120
Technology: ThinGaN (UX:3)
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
OSRAM Opto Semiconductors
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Description
OSLON Compact CL
Product Features
Package: Ceramic package
Feature of the device: small size high-flux LED for slim designs high robustness
Color: acc. to white area ECE/SAE
Viewing angle at 50 % IV: 120
Technology: ThinGaN (UX:3)
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
OSLON Compact CL
Product Features
Package: Ceramic package
Feature of the device: small size high-flux LED for slim designs high robustness
Color: acc. to white area ECE/SAE
Viewing angle at 50 % IV: 120
Technology: ThinGaN (UX:3)
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
OSLON Compact CL
Product Features
Package: Ceramic package
Feature of the device: small size high-flux LED for slim designs high robustness
Color: acc. to white area ECE/SAE
Viewing angle at 50 % IV: 120
Technology: ThinGaN (UX:3)
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
